I would like to optimise the heat transfer on a PCB. Several dies are on the top and cooling air is going through the fins in heat sink on the bottom. The assembly consists of several layers like shown in the simplified figure below.
I would like to investigate the influence of for instance several thermal greases on the maximum temperature of the chips: I want to vary the thermal coefficient and the thickness of the thermal grease layer.
The “problem”/”issue” is that the dimensions in the Z direction (micrometer) are much smaller than X and Y directions (~10 mm). This makes the meshing process complicated using “naive” finite element simulations.
Is there a better approach to analyse this type of layered assembly using finite element simulation?